Nov 25, 2019 - 02:20 PM
Therefore, when using any of our Dielectric Coolants, including BitCool or ElectroCool, we strongly recommend replacing any grease based thermal interface material with any one of the following materials
NOTE: A full list of tested thermal interface materials can be found on our Material Compatibility Guide found under Support on our website.
1) Thermal Epoxy
If you are looking for a permanent solution, similar to what is used on crypto miners where the heat sink is "glued" onto the chip, we recommend using a 2-part thermal epoxy. We have had excellent success with MasterBond EP48TC and TIGA 920-H / 2-part Flexible, Silver-Filled Epoxy Adhesive by
Resin Technology Group, LLC. Both are two-part epoxies with good thermal conductivity and bonding strength.
2) Indium Foil
When you need a high-performance Thermal Transfer Interface material for servers, GPUs, and similar type devices where the heat sink can be easily removed and replaced, we recommend the use of Indium Heat Spring
3) Silicone Based Thermal Pastes and Pads
Thermal pastes and pads based on silicone formulations are generally compatible with our Dielectric Coolants if they are fully cured. Thermal pads will often absorb some fluid making them swell slightly, however this swelling rarely impacts their performance.
4) Liquid Metal TIMs
There is a new class of TIMs made from various types of high thermal density soft metals. We have tested a number of these TIMS such as: Conductonaut, by Thermal Grizzly, and Ultra Liquid by CoolLaboratory. These materials have excellent heat transfer characteristics but often have warnings regarding the types of materials that they can be used with. In particular, they are often incompatible with aluminum so be sure to read the user instructions with these materials.