Nov 25, 2019 - 02:20 PM
When you need significant Thermal Transfer Interface material and it needs to be removable we recommend the use of Indium Heat Spring. For servers, CPUs, GPUs, and FPGAs we use Indium Heat Spring.
Thermal ”greases” based on silicone formulations are generally compatible after they fully cured, however all hydrocarbon based thermal interface materials are not compatible and will breakdown quickly in our Dielectric Coolants.
If a hydrocarbon based thermal grease is used and it deteriorates into your coolant it generally will discolor the coolant, but if it is a small amount it will often have no impact on the dielectric strength or performance of the Dielectric Coolant. However, this type of contamination will void the characteristics warranty of your coolant and should be avoided.
We have found that some, but not all, thermal pads may degrade over time in our coolants, however, we recommend testing them as per our Materials Compatibility Test method to determine long term compatibility.
NOTE 2019.12.01 - We are in the process of testing Fujipoly Thermal Pads and will update the our Materials Compatibility Guide once that testing is complete with our results.